DEVICE FOR MEASURING DEPOSIT THICKNESS USING ULTRASONIC WAVES, AND METHOD THEREFOR

WIPO Patent Application WO/2017/086150

A1

Provided are: a device for measuring the thickness of a deposit within a pipe used in a plant or the like; and a method for such measurement. The device for measuring the thickness of a deposit using ultrasonic waves comprises: an ultrasonic wave transmitting element disposed on one side of a pipe; an ultrasonic wave receiving element disposed facing the transmitting element, with the pipe therebetween; an ultrasonic wave transceiver that drives the ultrasonic wave transmitting element and that receives a signal from the ultrasonic wave receiving element; a propagation time measurement unit that measures the propagation time of an ultrasonic wave that has propagated through a medium within the pipe; and a deposit thickness calculation unit that calculates the thickness of a deposit within the pipe from the propagation time using the outer diameter of the medium and sound speed data.

JP2894418	[Title of Invention] A device for measuring sediment in a waterway
JP2001521165	PROBLEM TO BE SOLVED: To measure the thickness of an object, more specifically, the wall thickness of an extruded object such as a plastic tube.
WO/2000/073739	MEASURING SYSTEM INCLUDING POSITIONING AND DATE TRANSFER

NAGASHIMA YOSHIAKI (JP)

PCT/JP2016/082506

May 26, 2017

November 02, 2016

Click for automatic bibliography generation  

HITACHI LTD (JP)

G01B17/02; G01N29/07; G01N29/44

JPS6254112A	1987-03-09
JP2008076296A	2008-04-03
JP2002328119A	2002-11-15

TODA Yuji (JP)

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