Title:
DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/241095
Kind Code:
A1
Abstract:
A device for manufacturing a semiconductor device comprises: a stage (12); a bonding head (14); a following mechanism (22) mounted on the bonding head (14); and a controller (34) that executes an adjustment process. In the adjustment process, after putting the following mechanism (22) in a lock state, the controller (34) brings a facing surface (50) of the bonding head (14) into contact with a reference surface (110) of the stage (12), and after switching the following mechanism (22) to a free state, presses the facing surface (50) against the reference surface (110), and then switches the following mechanism (22) back to the lock state.
Inventors:
EGUCHI YUJI (JP)
SEYAMA KOHEI (JP)
SEYAMA KOHEI (JP)
Application Number:
PCT/JP2021/016472
Publication Date:
December 02, 2021
Filing Date:
April 23, 2021
Export Citation:
Assignee:
SHINKAWA KK (JP)
International Classes:
H01L21/52; H01L21/60; H05K13/04
Foreign References:
| JPH053223A | 1993-01-08 | |||
| JPH1116951A | 1999-01-22 |
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
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