Title:
DEVICE AND METHOD FOR POLISHING, AND METHOD AND DEVICE FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2002/049802
Kind Code:
A1
Abstract:
A polishing device (100), comprising a drum (120), a chuck table (131) rotatingly holding a semiconductor wafer (100), and a pressing cylinder (170) moving the chuck table (131) so that the edge part (11) of the semiconductor wafer (10) comes into contact with a polished surface (112A) at a specified angle ($g(u)2), wherein the drum (120) further comprising a polishing member (122) having a generally conical polishing surface (122A) on the inner surface thereof and the polishing member (122) is formed rotatably around a rotating shaft (120R), whereby, when the edge part of a circular substrate is polished, slurry polishing fluid can be efficiently recovered, and repair and inspection operations can be performed safely.
Inventors:
IZUMI SHIGETO (JP)
Application Number:
PCT/JP2001/010845
Publication Date:
June 27, 2002
Filing Date:
December 11, 2001
Export Citation:
Assignee:
NIPPON KOGAKU KK (JP)
IZUMI SHIGETO (JP)
IZUMI SHIGETO (JP)
International Classes:
B24B9/06; B24B21/00; (IPC1-7): B24B9/00; B24B21/02; B24B21/20; H01L21/304
Foreign References:
| JP2002036079A | 2002-02-05 | |||
| JPH1029142A | 1998-02-03 | |||
| JP2000317788A | 2000-11-21 | |||
| JP2000141190A | 2000-05-23 | |||
| JPH11221744A | 1999-08-17 | |||
| JPH09300196A | 1997-11-25 | |||
| JPH0957586A | 1997-03-04 | |||
| JP2000150431A | 2000-05-30 |
Attorney, Agent or Firm:
Hosoe, Toshiaki (Nishikanagawa 1-Chome Kanagawa-ku Yokohama-Shi, Kanagawa, JP)
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