Title:
DEVICE FOR PRE-MEASURING WAFER PRESSING FORCES
Document Type and Number:
WIPO Patent Application WO/2020/101163
Kind Code:
A1
Abstract:
The present invention relates to a device for pre-measuring wafer pressing forces, which measures, in advance, pressing forces applied to a plurality of points on a wafer disposed in a chuck during an actual semiconductor process. The present invention comprises: a locking and fixing protrusion unit which includes a plurality of locking and fixing protrusions provided along the edge of the top surface portion of a disc-shaped chuck; a rotary pressing protrusion unit which includes a plurality of rotary pressing protrusions provided in the vicinity of the plurality of locking and fixing protrusions constituting the locking and fixing protrusion unit; a pressing force test jig which is locked and fixed to the plurality of fixing protrusions constituting the locking and fixing protrusion unit and serves as an object which is subjected to a pressing force pre-measurement in place of a wafer disposed in the chuck in an actual semiconductor process; a pressing force sensor unit which is coupled to the pressing force test jig and includes a plurality of pressing force sensors that measure pressing forces applied by the rotation of the plurality of rotary pressing protrusions constituting the rotary pressing protrusion unit; and a contact jig unit which includes a plurality of contact jigs that transmit the pressing forces, applied by the rotation of the plurality of rotary pressing protrusions constituting the rotary pressing protrusion unit, to the plurality of pressing force sensors constituting the pressing force sensor unit.
Inventors:
PARK BYUNG HO (KR)
Application Number:
PCT/KR2019/011688
Publication Date:
May 22, 2020
Filing Date:
September 10, 2019
Export Citation:
Assignee:
MUJIN ELECTRONICS CO LTD (KR)
International Classes:
H01L21/67; H01L21/66; H01L21/687
Foreign References:
| KR20180039424A | 2018-04-18 | |||
| KR20170024215A | 2017-03-07 | |||
| KR20010077104A | 2001-08-17 | |||
| JP2010062317A | 2010-03-18 | |||
| US20010013684A1 | 2001-08-16 |
Attorney, Agent or Firm:
DARAE LAW & IP, LLC (KR)
Download PDF:
Previous Patent: SUPER POWER-SAVING SENSOR LAMP CONTROL DEVICE
Next Patent: DOPED TIN OXIDE THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING SAME
Next Patent: DOPED TIN OXIDE THIN FILM TRANSISTOR AND METHOD FOR MANUFACTURING SAME