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Patent Searching and Data


Title:
DEVICE FOR REDUCING DEFORMATION OF LARGE-AREA COPPER SHEET AFTER WELDING
Document Type and Number:
WIPO Patent Application WO/2021/056779
Kind Code:
A1
Abstract:
Disclosed is a device for reducing the deformation of a large-area copper sheet (7) after welding, belonging to the technical field of copper sheet welding processing. The device comprises an upper supporting seat (1), a lower supporting seat (2), an upper pressing plate (4) and a lower pressing plate (6), wherein the upper pressing plate (4) is detachably mounted at the bottom of the upper supporting seat (1); the upper pressing plate (4) is provided with a plurality of hollowed-out mesh holes (41); the upper supporting seat (1) is provided with hollowed-out exhaust holes (11); the mesh holes (41) are in communication with the exhaust holes (11); the lower pressing plate (6) is detachably mounted at the top of the lower supporting seat (2); the upper supporting seat (1) is mounted on the lower supporting seat (2) by means of fastening screws (3); and a central boss (61) for arranging the copper sheet (7) is arranged in the center of the upper surface of the lower pressing plate (6), such that the technical problems of same being prone to deforming, the welding rejection rate being high, and the welding efficiency and the welding quality being low when the copper sheet (7) and the wafer (5) are welded in the prior art are solved.

Inventors:
ZHANG RU (CN)
ZANG TIANCHENG (CN)
JIANG WEIBIN (CN)
AN YONG (CN)
JIN HAO (CN)
Application Number:
PCT/CN2019/119753
Publication Date:
April 01, 2021
Filing Date:
November 20, 2019
Export Citation:
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Assignee:
YANTAI TAIXIN ELECTRONIC TECH CO LTD (CN)
International Classes:
B23K3/08; B23K37/04
Foreign References:
CN201807839U2011-04-27
CN106736767A2017-05-31
CN2590327Y2003-12-03
CN202461874U2012-10-03
CN103358024A2013-10-23
US20130320069A12013-12-05
Attorney, Agent or Firm:
BEIJING ZHONGCHUANG BOTEN INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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