Title:
DEVICE SUBSTRATE WASHING METHOD
Document Type and Number:
WIPO Patent Application WO/2007/114448
Kind Code:
A1
Abstract:
Disclosed is a device substrate washing method which can fully remove a resist attached to a device substrate, particularly a resist attached to a perforated part of a fine pattern which has a large aspect ratio. The method comprises a washing step for removing a resist attached to a device substrate with a solvent, wherein the solvent is a composition comprising at least one fluorinated compound selected from the group consisting of hydrofluoroether, hydrofluorocarbon and perfluorocarbon and a fluorinated alcohol.
Inventors:
OKAMOTO HIDEKAZU (JP)
NAMATSU HIDEO (JP)
NAMATSU HIDEO (JP)
Application Number:
PCT/JP2007/057497
Publication Date:
October 11, 2007
Filing Date:
April 03, 2007
Export Citation:
Assignee:
ASAHI GLASS CO LTD (JP)
NTT ADVANCED TECH KK (JP)
OKAMOTO HIDEKAZU (JP)
NAMATSU HIDEO (JP)
NTT ADVANCED TECH KK (JP)
OKAMOTO HIDEKAZU (JP)
NAMATSU HIDEO (JP)
International Classes:
G03F7/42; C11D7/50; H01L21/027; H01L21/304
Foreign References:
| JP2004075910A | 2004-03-11 | |||
| JP2003282518A | 2003-10-03 |
Attorney, Agent or Firm:
SENMYO, Kenji et al. (SIA Kanda Square17, Kanda-konyach, Chiyoda-ku Tokyo 35, JP)
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