Title:
DICING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/051375
Kind Code:
A1
Abstract:
The placement surface (10a) of a stage (10) is supported so as to have a tilt angle (θ) from a reference horizontal surface (A) orthogonal to the vertical direction in a process of dicing while pouring cleaning water. This is performed in order to reduce the cost involved in manufacturing a semiconductor device. The tilt angle (θ) is set so as to be no smaller than the angle at which the pooling of the cleaning water blown onto a semiconductor wafer placed on the stage (10) begins to be disrupted.
Inventors:
MARUSHIMA YOSHINARI
Application Number:
PCT/JP2012/073110
Publication Date:
April 11, 2013
Filing Date:
September 10, 2012
Export Citation:
Assignee:
SHARP KK (JP)
MARUSHIMA YOSHINARI
MARUSHIMA YOSHINARI
International Classes:
H01L21/301; B24B41/06
Foreign References:
| JPH1092772A | 1998-04-10 | |||
| JP2009131921A | 2009-06-18 | |||
| JPS60130010U | 1985-08-31 | |||
| JPS6427904A | 1989-01-30 | |||
| JPH06275712A | 1994-09-30 | |||
| JPS63151405A | 1988-06-24 | |||
| JPS61148004A | 1986-07-05 | |||
| JPH11298023A | 1999-10-29 | |||
| JPH11283939A | 1999-10-15 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
Patent business corporation Hara [Kenzo] international patent firm (JP)
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