Title:
DICING DEVICE AND DICING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/029988
Kind Code:
A1
Abstract:
Provided are a dicing device and a dicing method which are capable of cutting even a workpiece composed of a brittle material stably and accurately in a ductile mode without causing cracks and breakage. A dicing device for cutting a workpiece is provided with: a dicing blade (26) which is formed into a disc shape from a diamond sintered compact (80) formed by sintering diamond abrasive grains, and has minute cutting edges continuous along the circumferential direction of an outer peripheral part; a spindle (rotation mechanism) which rotates the dicing blade (26); and a movement mechanism which moves the workpiece relatively with respect to the dicing blade (26) while a depth of cut is given to the workpiece by the dicing blade (26).
Inventors:
WATANABE JUNJI (JP)
FUJITA TAKASHI (JP)
FUJITA TAKASHI (JP)
Application Number:
PCT/JP2014/072268
Publication Date:
March 05, 2015
Filing Date:
August 26, 2014
Export Citation:
Assignee:
TOKYO SEIMITSU CO LTD (JP)
WATANABE JUNJI (JP)
WATANABE JUNJI (JP)
International Classes:
H01L21/301; B24B27/06; B24D3/00; B24D5/12
Foreign References:
| JP2002192469A | 2002-07-10 | |||
| JP2010010514A | 2010-01-14 | |||
| JP2012086291A | 2012-05-10 | |||
| JP2010050324A | 2010-03-04 | |||
| JP2001334471A | 2001-12-04 | |||
| JP2009045723A | 2009-03-05 |
Attorney, Agent or Firm:
MATSUURA, Kenzo (JP)
Kenzo Matsuura (JP)
Kenzo Matsuura (JP)
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