Title:
DICING-SHEET SUBSTRATE FILM AND DICING SHEET
Document Type and Number:
WIPO Patent Application WO/2014/103468
Kind Code:
A1
Abstract:
A dicing-sheet substrate film (2) equipped with a resin layer (A), wherein: the resin layer (A) contains a polyethylene (a1) having a density of 0.900g/cm3 or higher, and a styrene elastomer (a2); and the amount of the polyethylene (a1) contained represents 50-90 mass%, inclusive, of the total resin component contained in the resin layer (A), while the amount of the styrene elastomer (a2) contained represents 10-50 mass%, inclusive, of the total resin component contained in the resin layer (A). The dicing-sheet substrate film (2) does not require imparting physical energy such as electron rays or γ-rays thereto, suppresses the production of dicing scraps produced when dicing the article to be cut, and has sufficient expandability during the expansion step.
Inventors:
TAYA NAOKI (JP)
UEDA MASASHI (JP)
ITO MASAHARU (JP)
UEDA MASASHI (JP)
ITO MASAHARU (JP)
Application Number:
PCT/JP2013/077503
Publication Date:
July 03, 2014
Filing Date:
October 09, 2013
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; C09J7/29
Foreign References:
| JP2012209363A | 2012-10-25 | |||
| JP2009004568A | 2009-01-08 | |||
| JP2011216704A | 2011-10-27 | |||
| JP2002155249A | 2002-05-28 | |||
| JPH05211234A | 1993-08-20 | |||
| JP2005174963A | 2005-06-30 | |||
| JP2011216595A | 2011-10-27 |
Other References:
See also references of EP 2940716A4
Attorney, Agent or Firm:
HAYAKAWA, Yuzi et al. (JP)
Yuji Hayakawa (JP)
Yuji Hayakawa (JP)
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