DIE BONDER DEVICE - UENO SEIKI CO LTD

Title:

DIE BONDER DEVICE

Document Type and Number:

WIPO Patent Application WO/2014/087489

Kind Code:

A1

Abstract:

Provided is a die bonder device which does not compromise reliability of semiconductor elements even if stringing or excessive coating of the adhesive occur, and thus can accelerate the semiconductor element die bonding process. A ring holder (2), a paste coating device (5) and a substrate conveyance device (3) are arranged around a pickup device (4). The pickup device (4) is configured by radially arranging holding units (41) to which semiconductor elements can be removably attached. By rotating, the pickup device (4) positions, with the same timing, one of the holding units (41) opposite of a wafer ring of the ring holder (2), another of the holding units (41) opposite of the paste coating device (5), and a further one of the holding units (41) opposite of the substrate conveyance device (3). The paste coating device (5) coats the adhesive onto the mounting surface of the semiconductor elements held by the holding units (41).

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Inventors:

HARA YOSHIAKI (JP)
NAGASATO SHOICHI (JP)

Application Number:

PCT/JP2012/081410

Publication Date:

June 12, 2014

Filing Date:

December 04, 2012

Export Citation:

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Assignee:

UENO SEIKI CO LTD (JP)

International Classes:

H01L21/52

Foreign References:

JP2006513565A	2006-04-20
JPH10308403A	1998-11-17
JPH02239636A	1990-09-21