Title:
DIE DEVICE, MOLDING APPARATUS, INJECTION MOLDING SYSTEM, AND MOLDING MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/119228
Kind Code:
A1
Abstract:
[Problem] The present invention addresses the problem of providing a die, injection molding system and molding manufacturing method that limit the outflow of pressurized fluid injected into the cavity. [Solution] A die device and molding apparatus comprising: shafts 27 that are provided on a first die 205 and/or a second die 206 that form a molding space 200 and are for pushing a molding formed from resin that is injected into the molding space 200; ring-shaped elastic members, which are for supporting the shafts 27 and in which the open part of a groove formed along the circumferential direction faces toward the molding space; and an injection part, which is provided on the first die 205 and/or the second die 206 and is for injecting pressurized fluid into the molding space 200.
Inventors:
SUZUKI YASUHIRO (JP)
Application Number:
PCT/JP2016/086380
Publication Date:
July 13, 2017
Filing Date:
December 07, 2016
Export Citation:
Assignee:
SUZUKI YASUHIRO (JP)
International Classes:
B29C45/34; B29C45/17; B29C45/43
Foreign References:
| JPH11216748A | 1999-08-10 | |||
| JP2011255541A | 2011-12-22 | |||
| JPH11108193A | 1999-04-20 | |||
| JP2009299787A | 2009-12-24 | |||
| JPH0866946A | 1996-03-12 | |||
| JP2010184401A | 2010-08-26 | |||
| JP2004299357A | 2004-10-28 | |||
| JP2001162654A | 2001-06-19 | |||
| JPH06198691A | 1994-07-19 | |||
| JPH0866932A | 1996-03-12 |
Other References:
See also references of EP 3326778A4
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