Title:
DIE EXTENSION TOOL AND METHOD USING SAME TO EXTEND WAFER
Document Type and Number:
WIPO Patent Application WO/2016/034124
Kind Code:
A1
Abstract:
A die extension tool (300) and a method using the die extension tool (300) to extend a wafer (4) on a foil carrier (1). The die extension tool (300) is provided with an external main body (302), wherein a cavity is formed by the external main body (302), and a bracket (3) of the foil carrier (1) is placed in the cavity; an internal main body located in the cavity of the external main body (302), wherein the wafer (4) attached to a foil (2) of the foil carrier (1) is located on the internal main body; and a pressed fluid system located in the cavity of the external main body (302), wherein the pressed fluid system enables the bracket (3) to axially move around the internal main body and expand the foil (2).
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Inventors:
STOKKERMANS JOZEF PETRUS WILHELMUS (NL)
Application Number:
PCT/CN2015/088840
Publication Date:
March 10, 2016
Filing Date:
September 02, 2015
Export Citation:
Assignee:
NXP BV (NL)
International Classes:
H01L21/78
Foreign References:
| JPH03177051A | 1991-08-01 | |||
| CN101198450A | 2008-06-11 | |||
| DE102007046430A1 | 2008-12-11 | |||
| JP2014103196A | 2014-06-05 | |||
| JP2007080984A | 2007-03-29 | |||
| JPS61249708A | 1986-11-06 |
Attorney, Agent or Firm:
CHINA SCIENCE PATENT & TRADEMARK AGENT LTD. (CN)
中科专利商标代理有限责任公司 (CN)
中科专利商标代理有限责任公司 (CN)
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