DISPERSION MEDIUM FOR METAL PARTICLE SINTERING, AND ELECTROCONDUCTIVE PASTE

Title:

DISPERSION MEDIUM FOR METAL PARTICLE SINTERING, AND ELECTROCONDUCTIVE PASTE

Document Type and Number:

WIPO Patent Application WO/2021/166627

Kind Code:

A1

Abstract:

Provided are a dispersion medium for metal particle sintering that provides an electroconductive paste whereby metal particles are satisfactorily sintered at low temperature even when not in a reducing atmosphere, and an electroconductive paste in which the dispersion medium is used.　This dispersion medium for metal particle sintering contains formic acid and a basic compound, the basic compound being a nitrogen-containing compound represented by formula (1), and the mole ratio (basic group/formic acid) of basic groups included in the basic compound and formic acid being 0.50-1.20. [Chemical Formula 1] In formula (1): Ra-Rc are the same or different and represent a hydrogen atom or a hydrocarbon group that may have a substituent; the double line including a dashed line represents a single bond or a double bond, with Rc being absent in the case of a double bond; and any two of Ra-Rc may bond with each other to form a ring with the adjacent nitrogen atom.

Inventors:

KOBATAKE TAKANORI (JP)
SUGANUMA KATSUAKI (JP)
TAKATA SHUHEI (JP)

Application Number:

PCT/JP2021/003617

Publication Date:

August 26, 2021

Filing Date:

February 02, 2021

Export Citation:

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Assignee:

DAICEL CORP (JP)

International Classes:

B22F1/00; B22F9/00; C09K3/00; H01B1/22

Domestic Patent References:

WO2014084275A1	2014-06-05
WO2018029983A1	2018-02-15

Foreign References:

JP2014110514A	2014-06-12
JP2020025765A	2020-02-20
JP2018156736A	2018-10-04
JP2018170228A	2018-11-01

Other References: