Title:
DISPLAY MODULE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/176772
Kind Code:
A1
Abstract:
Provided is a display module that can reduce connection resistance between a mounting substrate and a display. This display module comprises a mounting substrate that is provided with a solder bump, and a display that is mounted on the mounting substrate, and is provided with a connection terminal which is solid-phase diffusion bonded with the solder bump.
Inventors:
NISHIKAWA HIROSHI (JP)
Application Number:
PCT/JP2022/005365
Publication Date:
August 25, 2022
Filing Date:
February 10, 2022
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
G09F9/00; G02F1/1345; G09F9/30; G09F9/33; H01L51/50; H05B33/06; H05B33/10
Foreign References:
| JP2002373779A | 2002-12-26 | |||
| US20200203382A1 | 2020-06-25 | |||
| JP2008165219A | 2008-07-17 | |||
| JP2003086363A | 2003-03-20 | |||
| US20200312940A1 | 2020-10-01 |
Attorney, Agent or Firm:
SUGIURA PATENT OFFICE et al. (JP)
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