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Title:
DISSIMILAR-METAL BONDING STRUCTURE, BONDING METHOD THEREFOR, AND ELECTRICAL-PRODUCT PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2018/030164
Kind Code:
A1
Abstract:
A dissimilar-metal bonding structure according to an embodiment of the present invention includes a first member, a second member, and a first metal layer. The first member contains a first metal. The second member contains a second metal that is different from the first metal. The second member has a stirring section. The first metal layer contains the second metal. The first metal layer is in contact with the stirring section and is located between the first member and the second member.

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Inventors:
TOMIOKA TAIZO (JP)
Application Number:
PCT/JP2017/027235
Publication Date:
February 15, 2018
Filing Date:
July 27, 2017
Export Citation:
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Assignee:
TOSHIBA KK (JP)
International Classes:
B23K20/12
Foreign References:
JP2006224146A2006-08-31
JP2005118877A2005-05-12
JP2005028378A2005-02-03
JP4404052B22010-01-27
Other References:
See also references of EP 3498413A4
Attorney, Agent or Firm:
HYUGAJI, Masahiko (JP)
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