Title:
DOUBLE-SIDED ADHESIVE SHEET, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/200789
Kind Code:
A1
Abstract:
The present invention relates to a double-sided adhesive sheet, and a method for manufacturing a semiconductor device using the double-sided adhesive sheet. The double-sided adhesive sheet has, in the following order, an adhesive layer (X1), a substrate layer (Y), and an adhesive layer (X2), wherein: at least one among the adhesive layer (X1) and the substrate layer (Y) is a heat-expandable layer containing heat-expandable particles; the adhesive layer (X2) is an energy ray-curable adhesive layer; and a laminate (LA) for measuring total light transmittance has a total light transmittance (TA), at a wavelength of 380 nm in the thickness direction, of 20% or more, the laminate (LA) being obtained by heating, for 1 minute at a temperature of the expansion start temperature (t) of the heat-expandable particles + 22 °C, a laminate formed by laminating a 1.1 mm-thick glass plate composed of soda lime glass on the adhesive layer (X2) of the double-sided adhesive sheet.
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Inventors:
KAKIUCHI YASUHIKO (JP)
Application Number:
PCT/JP2021/013198
Publication Date:
October 07, 2021
Filing Date:
March 29, 2021
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B24B7/00; B24B27/06; B24B41/06; B32B7/023; B32B27/00; C09J7/29; C09J7/38; C09J11/08; C09J201/00; H01L21/301; H01L21/304; H01L21/683
Domestic Patent References:
| WO2021049570A1 | 2021-03-18 |
Foreign References:
| JP2003292916A | 2003-10-15 | |||
| JP2013203800A | 2013-10-07 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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