Title:
DRY FILM, CURED ARTICLE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/195843
Kind Code:
A1
Abstract:
A dry film 11 includes a curable resin layer 12 made of a light-shielding curable resin composition containing: a polymer resin having a glass transition point of 20°C or less and a weight average molecular weight of 10,000 or greater; a coloring agent; and an inorganic filler. When the thickness of the curable resin layer 12 is X (μm), the largest particle diameter of aggregate particles of the inorganic filler is X/2 (μm) or less. The dry film 11 has excellent light-shielding performance, and is configured such that warping is suppressed and burrs and chipping during dicing can also be suppressed.
Inventors:
ENDO ARATA (JP)
NAKADA KAZUTAKA (JP)
NAKADA KAZUTAKA (JP)
Application Number:
PCT/JP2020/010575
Publication Date:
October 01, 2020
Filing Date:
March 11, 2020
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08J5/18; C08K3/00; C08K3/013; C08L63/00; C08L101/00; G03F7/004; G03F7/027
Domestic Patent References:
| WO2013161756A1 | 2013-10-31 |
Foreign References:
| JP2017178990A | 2017-10-05 | |||
| JP2005238469A | 2005-09-08 | |||
| JP2016050224A | 2016-04-11 |
Attorney, Agent or Firm:
HONDA Ichiro (JP)
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