Title:
DUSTPROOF STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/082183
Kind Code:
A1
Abstract:
Disclosed are a dustproof structure and a manufacturing method therefor. The dustproof structure is used for carrying out dustproofing for a sensor, and the sensor comprises a housing and a sensing unit arranged inside the housing, wherein the housing is provided with a communicating hole, the communicating hole is in communication with the sensing unit and the external environment, and a dustproof portion of the dustproof structure covers the communicating hole. The manufacturing method for the dustproof structure comprises the following steps: providing a substrate, and arranging a release film on a surface of the substrate; carrying out deposition on a surface of the release film to form a metal layer; forming a plurality of dustproof net holes in the metal layer by means of laser drilling, wherein the plurality of dustproof net holes jointly form a dustproof portion; and separating the metal layer on which the dustproof portion is formed from the release film. According to the technical solution of the present invention, the dustproof structure has a good dustproof function, can allow a dustproof sensor to communicate with the external environment, and guarantees the detection sensitivity and the measurement accuracy of the sensor.
Inventors:
CAI MENGJIN (CN)
Application Number:
PCT/CN2019/123541
Publication Date:
May 06, 2021
Filing Date:
December 06, 2019
Export Citation:
Assignee:
WEIFANG GOERTEK MICROELECTRONICS CO LTD (CN)
International Classes:
G01D11/24
Foreign References:
| CN208807639U | 2019-05-03 | |||
| CN105554654A | 2016-05-04 | |||
| CN104979733A | 2015-10-14 | |||
| CN208523137U | 2019-02-19 | |||
| US20170134547A1 | 2017-05-11 |
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