Title:
DUSTPROOF STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/082184
Kind Code:
A1
Abstract:
Disclosed in the present invention are a dustproof structure and a manufacturing method therefor. The dustproof structure is used for dust prevention of a sensor; the sensor comprises a housing and a sensing unit provided in the housing; the housing is provided with a communication hole; the communication hole is communicated with the sensing unit and an external environment; the dustproof portion of the dustproof structure covers the communication hole. The manufacturing method for the dustproof structure comprises the following steps: providing a substrate, and providing a release film on one surface of the substrate; performing deposition on the surface of the release film to form a metal layer; forming a plurality of dustproof mesh holes on the metal layer by means of a photoetching process, wherein the plurality of dustproof mesh holes together form a dustproof portion; and mutually separating the metal layer forming the dustproof portion from the release film. The technical solution of the present invention is aimed at making the dustproof structure have a good dustproof function, also can make the dustproof sensor be communicated with the external environment, and ensures the detection sensitivity and the measurement accuracy of the sensor.
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Inventors:
CAI MENGJIN (CN)
Application Number:
PCT/CN2019/123542
Publication Date:
May 06, 2021
Filing Date:
December 06, 2019
Export Citation:
Assignee:
WEIFANG GOERTEK MICROELECTRONICS CO LTD (CN)
International Classes:
G01D11/24
Foreign References:
| CN106744664A | 2017-05-31 | |||
| CN208336798U | 2019-01-04 | |||
| CN102611954A | 2012-07-25 | |||
| JP2006252368A | 2006-09-21 |
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