Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/014493
Kind Code:
A1
Abstract:
Provided is an elastic wave device that can increase heat dissipation in a situation in which a cavity is provided to a support substrate. An elastic wave device 1 according to the present invention comprises: a cavity 10; a support substrate 2 that has a support part 12; a piezoelectric film (lithium niobate film 3) that is provided on the support part 12 and has a first and a second main surface 3a, 3b; a function electrode 4 provided to the first main surface 3a; and a heat dissipation film 5 provided to at least one of the first and the second main surfaces 3a, 3b of the piezoelectric film and composed of a semiconductor or an insulator. The function electrode 4 has at least one pair of first and second electrodes 6, 7. When dx is the thickness of the piezoelectric film and p is the distance between the centers of the neighboring first and second electrodes 6, 7, dx/p is no more than 0.5. In a planar view, the heat dissipation film 5 overlaps with at least a portion of the support part 12. The thermal conductance of the heat dissipation film 5 is greater than the thermal conductance of the piezoelectric film, and the heat dissipation film 5 is thinner than the piezoelectric film.
Inventors:
NAGATOMO SHO (JP)
Application Number:
PCT/JP2021/025975
Publication Date:
January 20, 2022
Filing Date:
July 09, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2012073871A1 | 2012-06-07 | |||
| WO2016147687A1 | 2016-09-22 |
Foreign References:
| JPH05183376A | 1993-07-23 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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