ELASTIC WAVE DEVICE

WIPO Patent Application WO/2022/131076

A1

Provided is an elastic wave device that can promote miniaturization.　This elastic wave device 10 comprises: a support member 13; a piezoelectric layer 14 having a first main surface 14a and a second main surface 14b positioned at the support-member 13 side; a first IDT electrode 11A provided on the first main surface 14a, the first IDT electrode 11A having a plurality of first and second electrode fingers 26, 27; and a second IDT electrode 11B provided on a portion of the second main surface 14b that does not overlap the first IDT electrode 11A in plan view, the second IDT electrode 11B having a plurality of first and second electrode fingers 28, 29. In the first and second IDT electrodes 11A, 11B, d/p is 0.5 or less, where d is the thickness of the piezoelectric layer 14, and p is the distance between the centers of adjacent electrode fingers. Furthermore comprised are: an insulating film 17 provided on a portion of the second main surface 14b that overlaps the first IDT electrode 11A in plan view; and a wiring electrode 18 passing over the insulating film17 in the portion that overlaps the first IDT electrode 11A when seen in plan view, the wiring electrode 18 being connected to the second IDT electrode 11B.

OUCHI MINEFUMI (JP)

PCT/JP2021/044930

June 23, 2022

December 07, 2021

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MURATA MANUFACTURING CO (JP)

H03H3/08; H03H9/145

WO2007007462A1	2007-01-18
WO2013021948A1	2013-02-14

JP2002534886A	2002-10-15
JP2005217818A	2005-08-11
JP2017220778A	2017-12-14

MIYAZAKI & METSUGI (JP)

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