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Patent Searching and Data


Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/138457
Kind Code:
A1
Abstract:
Provided is an elastic wave device that makes it possible to increase heat dissipation in configurations in which a support member includes a cavity section. The elastic wave device 10 comprises: a support member 13; a piezoelectric layer 14; an IDT electrode 25 including first and second busbars 26, 27 and a plurality of first and second electrode fingers 28, 29; and dielectric films 17A, 17B provided on the piezoelectric layer 14 so as to overlap with at least part of the IDT electrode 25 in a planar view. When d represents the thickness of the piezoelectric layer 14 and p represents the distance between the centers of adjacent electrode fingers, d/p is 0.5 or less. The support member 13 is provided with a cavity section 13c opening on the piezoelectric layer 14 side. The IDT electrode 25 includes a crossover region E and first and second gap regions G1, G2. The dielectric films 17A, 17B are provided to at least part of the first and second gap regions G1, G2, and the thermal conductivity of the dielectric films 17A, 17B is higher than the thermal conductivity of the piezoelectric layer 14.

Inventors:
KIMURA TETSUYA (JP)
Application Number:
PCT/JP2021/046580
Publication Date:
June 30, 2022
Filing Date:
December 16, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H9/145
Domestic Patent References:
WO2020130128A12020-06-25
WO2020045442A12020-03-05
WO2019009373A12019-01-10
WO2018163860A12018-09-13
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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