Title:
SHOCK-ABSORBING ADHESIVE SHEET
Document Type and Number:
WIPO Patent Application WO/2022/138458
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a shock-absorbing adhesive sheet with which a shock caused by a collision of an electronic component can be sufficiently absorbed, and an electronic component can be received without damage to or offsetting the position of the electronic component, even if the shock-absorbing layer is thin. A shock-absorbing adhesive sheet 1 according to the present invention has at least one adhesive layer 10. The ratio (sinking depth/thickness×100) of the sinking depth, which is found using a thermomechanical analysis (TMA) of the adhesive layer 10 under the following conditions, relative to the thickness of the adhesive layer 10 is at least 10%. The shock-absorbing adhesive sheet 1 according to the present invention preferably has at least one layer of a base material 11. [Thermomechanical Analysis (TMA)] Probe diameter: 1.0 mm; Mode: penetration mode; Indentation load: 0.05 N; Measurement environment temperature: -40°C; Indentation load time: 20 min
Inventors:
KATO KAZUMICHI (JP)
UENO SHUSAKU (JP)
HIRAYAMA TAKAMASA (JP)
UENO SHUSAKU (JP)
HIRAYAMA TAKAMASA (JP)
Application Number:
PCT/JP2021/046581
Publication Date:
June 30, 2022
Filing Date:
December 16, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
C09J133/00; C09J7/25; C09J7/38; H01L21/58; H01L21/683
Domestic Patent References:
| WO2019216262A1 | 2019-11-14 | |||
| WO2014061774A1 | 2014-04-24 | |||
| WO2020121735A1 | 2020-06-18 |
Foreign References:
| JP2020053558A | 2020-04-02 | |||
| JP2008248199A | 2008-10-16 | |||
| JP2018060993A | 2018-04-12 |
Attorney, Agent or Firm:
G-CHEMICAL INTELLECTUAL PROPERTY FIRM (JP)
Download PDF: