Title:
ELASTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/219134
Kind Code:
A1
Abstract:
An elastic wave device according to the present disclosure comprises: a package substrate; and an elastic wave element that is bonded to a main surface of the package substrate with a plurality of electrically conductive bumps interposed therebetween, the elastic wave element having one or more resonators and wiring that is electrically connected to the resonators. The plurality of electrically conductive bumps comprise one or more first bumps, and a second bump that is surrounded by at least one of at least one first bump and at least one resonator as seen in an orthogonal direction that is orthogonal to the main surface of the package substrate. On the package substrate, there is formed an electrically conductive pattern that is electrically connected to the second bump. As seen in the orthogonal direction, the electrically conductive pattern extends from the second bump, across at least one of a resonator and the wiring, from the inside of the first bump and the resonator surrounding the second bump toward the outside.
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Inventors:
YAMAUCHI JUNJI (JP)
YAMAZAKI SUNAO (JP)
YAMAZAKI SUNAO (JP)
Application Number:
PCT/JP2023/017762
Publication Date:
November 16, 2023
Filing Date:
May 11, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H9/145
Foreign References:
| JP2007116628A | 2007-05-10 | |||
| US20210044277A1 | 2021-02-11 | |||
| JP2014013991A | 2014-01-23 | |||
| JP2010245722A | 2010-10-28 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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