Title:
ELASTIC WAVE ELEMENT, ELASTIC WAVE FILTER, SPLITTER, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/167034
Kind Code:
A1
Abstract:
The present invention improves loss characteristics of an elastic wave element. This elastic wave element comprises: a piezoelectric film; an IDT electrode located on the piezoelectric film; a low sound velocity film exhibiting a sound velocity slower than that of an elastic wave that propagates through the piezoelectric film; and a support substrate exhibiting a sound velocity faster than that of the elastic wave. When p denotes an electrode finger pitch of the IDT electrode, Tp denotes the thickness of the piezoelectric film, and Ti denotes the thickness of the low sound velocity film, and when the standardized piezoelectric film thickness tp and the standardized low sound velocity film thickness ti are respectively represented by tp=Tp/(2p) and ti=Ti/(2p), tp and ti satisfy [Num. 1].
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Inventors:
KIMURA TOSHIYA (JP)
NOZOE SOICHIRO (JP)
NOZOE SOICHIRO (JP)
Application Number:
PCT/JP2023/005970
Publication Date:
September 07, 2023
Filing Date:
February 20, 2023
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H03H9/145; H03H9/25
Domestic Patent References:
| WO2020204036A1 | 2020-10-08 | |||
| WO2016208446A1 | 2016-12-29 |
Foreign References:
| JP2020102662A | 2020-07-02 | |||
| JP2021100280A | 2021-07-01 |
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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