Title:
ELECTRIC CONNECTION INSPECTION DEVICE, AND MANUFACTURING METHOD AND ELECTRIC CONNECTION METHOD FOR SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/202076
Kind Code:
A1
Abstract:
An electric connection inspection device 200 includes: a cooling plate 21; an insulating plate 22 provided on the cooling plate 21; a measurement electrode 24 provided on the insulating plate 22; and a measurement electrode 26 and a measurement electrode 27 provided above the measurement electrode 24 and located apart from the measurement electrode 24. The insulating plate 22 includes a variable thermal resistance mechanism. A semiconductor device 100 can be installed between the measurement electrode 24 and the measurement electrode 26 and between the measurement electrode 24 and the measurement electrode 27.
Inventors:
SAGAWA MASAKAZU (JP)
KONISHI KUMIKO (JP)
MIKI HIROSHI (JP)
MORI YUKI (JP)
KONISHI KUMIKO (JP)
MIKI HIROSHI (JP)
MORI YUKI (JP)
Application Number:
PCT/JP2022/007632
Publication Date:
September 29, 2022
Filing Date:
February 24, 2022
Export Citation:
Assignee:
HITACHI POWER SEMICONDUCTOR DEVICE LTD (JP)
International Classes:
H01L21/66; H01L21/336; H01L29/12; H01L29/78
Foreign References:
| JP2020150181A | 2020-09-17 | |||
| JP2019216202A | 2019-12-19 | |||
| JP2018205252A | 2018-12-27 | |||
| JP2017212317A | 2017-11-30 | |||
| JP2020187102A | 2020-11-19 |
Attorney, Agent or Firm:
TSUTSUI & ASSOCIATES (JP)
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