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Title:
ELECTRICAL DEVICE AND ELECTRICAL DEVICE FABRICATION METHOD
Document Type and Number:
WIPO Patent Application WO/2014/112624
Kind Code:
A1
Abstract:
This electrical device fabrication method comprises: overlaying a sheet, whereupon an adhesive is positioned, upon a first substrate; transferring the adhesive from the sheet to the first substrate; overlaying a second substrate upon the adhesive and the first substrate; and bonding the first substrate and the second substrate together, with the adhesive.

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Inventors:
KOBAYASHI TAKAYUKI (JP)
NAKAJIMA SETSUO (JP)
OOTSUKA TOMOHIRO (JP)
NAKAJIMA HIDEYASU (JP)
Application Number:
PCT/JP2014/050981
Publication Date:
July 24, 2014
Filing Date:
January 20, 2014
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01M14/00; H01L31/04
Domestic Patent References:
WO2006126271A12006-11-30
Foreign References:
JP2010109354A2010-05-13
JPH02199847A1990-08-08
JP2007201185A2007-08-09
JP2012190740A2012-10-04
JP2011159514A2011-08-18
JP2005340710A2005-12-08
JP2003059546A2003-02-28
JP2010182467A2010-08-19
JP2005251605A2005-09-15
Attorney, Agent or Firm:
SAEKI Yoshifumi et al. (JP)
Yoshifumi Saeki (JP)
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