Title:
ELECTRICALLY CONDUCTIVE PASTE, CONNECTION STRUCTURE, AND PRODUCTION METHOD FOR CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/104275
Kind Code:
A1
Abstract:
Provided is an electrically conductive paste that makes it possible to efficiently arrange solder particles upon an electrode and that makes it possible to improve the reliability of conduction between electrodes. This electrically conductive paste includes: as a thermosetting component, a thermosetting compound and a heat-curing agent; and a plurality of solder particles. The heat-curing agent includes an amine curing agent, a thiol curing agent, or a hydrazide curing agent.
Inventors:
ISHIZAWA HIDEAKI (JP)
UENOYAMA SHINYA (JP)
UENOYAMA SHINYA (JP)
Application Number:
PCT/JP2015/085194
Publication Date:
June 30, 2016
Filing Date:
December 16, 2015
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; B23K35/22; B23K35/363; C09J9/02; C09J11/04; C09J11/06; C09J201/00; H01L21/60; H01R11/01; H01R43/02; H05K1/14; H05K3/34; H05K3/36; B23K35/26
Foreign References:
| JP2013045650A | 2013-03-04 | |||
| JP2010126719A | 2010-06-10 | |||
| JPH03291807A | 1991-12-24 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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