Title:
ELECTRICALLY CONDUCTIVE PASTE, JOINED STRUCTURE, AND METHOD FOR MANUFACTURING JOINED STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2016/043265
Kind Code:
A1
Abstract:
Provided is an electrically conductive paste whereby it becomes possible to efficiently arrange solder particles on an electrode, it also becomes possible to prevent the positional displacement between electrodes and it also becomes possible to increase the reliability of electric continuity between electrodes.
The electrically conductive paste according to the present invention comprises a heat-curable compound that serves as a heat-curable component, a heat-curing agent and multiple solder particles, wherein the heat-curable compound comprises a crystalline heat-curable compound, and the solder particles are particles in each of which each of the center portion and the electrically conductive outer surface is made from a solder material.
Inventors:
ISHIZAWA HIDEAKI (JP)
SAITOU SATOSHI (JP)
UENOYAMA SHINYA (JP)
SAITOU SATOSHI (JP)
UENOYAMA SHINYA (JP)
Application Number:
PCT/JP2015/076467
Publication Date:
March 24, 2016
Filing Date:
September 17, 2015
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; H01B1/00; H01B5/16; H01L21/60; H01R11/01; H05K1/14; H05K3/28; H05K3/34
Foreign References:
| JP2014056816A | 2014-03-27 | |||
| JP2014130808A | 2014-07-10 | |||
| JP2009105117A | 2009-05-14 | |||
| JP2012044155A | 2012-03-01 | |||
| JP2008109115A | 2008-05-08 | |||
| JP2008266611A | 2008-11-06 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
Patent business corporation Miyazaki and table-of-contents patent firm (JP)
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