Title:
ELECTRICALLY CONDUCTIVE RESIN COMPOSITION AND CURED PRODUCT THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/199925
Kind Code:
A1
Abstract:
According to the present disclosure, provided is an electrically conductive resin composition which exhibits excellent storage stability and yields a cured product having low connection resistance. The present disclosure relates to an electrically conductive resin composition which contains components (A) to (E) and in which the organic solvent content is 1 mass% or less relative to the overall electrically conductive resin composition. Component (A): an epoxy resin having two or more epoxy groups per molecule. Component (B): a reactive diluent having one epoxy group per molecule. Component (C): rubber particles. Component (D): electrically conductive particles containing (d-1) and (d-2). (d-1): plate-type silver particles. (d-2): electrically conductive particles other than plate-type silver particles. Component (E): an epoxy curing agent.
Inventors:
SUZUKI TAKASHI (JP)
NEMOTO TAKASHI (JP)
NEMOTO TAKASHI (JP)
Application Number:
PCT/JP2023/014782
Publication Date:
October 19, 2023
Filing Date:
April 11, 2023
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
C08L63/00; C08K3/08; H01B1/00; H01B1/22
Domestic Patent References:
| WO2013150907A1 | 2013-10-10 | |||
| WO2013115360A1 | 2013-08-08 | |||
| WO2018047597A1 | 2018-03-15 |
Foreign References:
| JP2016160415A | 2016-09-05 |
Attorney, Agent or Firm:
IBC (JP)
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