Title:
ELECTROCONDUCTIVE PASTE AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/199924
Kind Code:
A1
Abstract:
The present disclosure relates to an electroconductive paste containing components (A) through (C). Component (A) is an epoxy resin, component (B) is a latent curing agent, and component (C) is a plate-like crystalline metal powder having an average grain size of 0.6 to 1.4 μm. The present invention provides an electroconductive paste that is capable of producing a balance between the conductivity and the adhesive strength of the resulting cured product.
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Inventors:
ENDO SATORU (JP)
SUZUKI TAKASHI (JP)
SUZUKI TAKASHI (JP)
Application Number:
PCT/JP2023/014781
Publication Date:
October 19, 2023
Filing Date:
April 11, 2023
Export Citation:
Assignee:
THREE BOND CO LTD (JP)
International Classes:
H01B1/22; C08K3/08; C08L63/00; H01B1/00
Foreign References:
| JP2014080558A | 2014-05-08 | |||
| JP2015162392A | 2015-09-07 | |||
| JP2007227156A | 2007-09-06 |
Attorney, Agent or Firm:
IBC (JP)
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