Title:
ELECTRICALLY INSULATED HEAT PIPE-TYPE SEMICONDUCTOR COOLING DEVICE
Document Type and Number:
WIPO Patent Application WO/1990/009037
Kind Code:
A1
Abstract:
A semiconductor cooling device comprising an electrically insulated heat pipe. The cooling device has a metallic block of, e.g., copper or aluminum on which a semiconductor can be mounted, and on the block are provided one or more heat pipes of the same shape and of the same quality in parallel with each other. An electrically insulated cylinder for electric insulation is arranged at a middle portion of each of the heat pipes, and a plurality of heat-radiating fins of, e.g., copper or aluminum are fitted onto the heat-radiating portion. A plurality of spiral grooves are formed in the inner peripheral surface of the heat pipes of the heat-radiating portion, the spiral grooves being tilted in one direction with respect to the axis of the pipe. In the inner peripheral surface of the heat pipes in the heat input portion are formed a plurality of first spiral grooves tilted in one direction with respect to the axis of the pipe and a plurality of second spiral grooves tilted in the opposite direction in a crossing manner.
Inventors:
MURASE TAKASHI (JP)
Application Number:
PCT/JP1990/000146
Publication Date:
August 09, 1990
Filing Date:
February 06, 1990
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
F28D15/02; F28D15/04; H01L23/427; (IPC1-7): H01L23/427
Foreign References:
| JPS62293655A | 1987-12-21 | |||
| JPS62293654A | 1987-12-21 | |||
| JPS5740882U | 1982-03-05 |
Other References:
See also references of EP 0417299A4
Attorney, Agent or Firm:
Suzuye, Takehiko (Chiyoda-ku, Tokyo 100, JP)
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