Title:
ELECTRO-CONDUCTIVE PASTE, ELECTRO-CONDUCTIVE FILM, ELECTRO-CONDUCTIVE CIRCUIT, ELECTRO-CONDUCTIVE LAMINATE, AND TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2015/046096
Kind Code:
A1
Abstract:
The electro-conductive paste has fine-line printability of 50μm or less, outstanding adhesion to an ITO film in an electro-conductive pattern formed by a low-temperature process at a temperature not exceeding 150°C, and achieves environmental reliability and high durability. The electro-conductive paste contains at least: a thermoplastic resin (A) and a thermoplastic resin (B), a hardener (C), an electro-conductive powder (D) and an organic solvent (E). The weight ratio of thermoplastic resin (A) to thermoplastic resin (B) does not exceed 4.0:1, and thermoplastic resin (A) is a polyurethane resin or a polyester resin having a weight-average molecular weight of at least 10,000 and a glass transition temperature of -10 to 150°C. Thermoplastic resin (B) is a polyester polyol and/or polyether polyol, having a number average molecular weight of 500 to 6,000.
Inventors:
SAKAMOTO YASUHIRO (JP)
KAWASHIMA WATARU (JP)
KINAMI MAKI (JP)
KAWASHIMA WATARU (JP)
KINAMI MAKI (JP)
Application Number:
PCT/JP2014/074994
Publication Date:
April 02, 2015
Filing Date:
September 22, 2014
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
H01B1/22; G06F3/041; H01B1/00; H01B5/14; H01B13/00; H05K1/09
Domestic Patent References:
| WO2011046076A1 | 2011-04-21 | |||
| WO2011083813A1 | 2011-07-14 | |||
| WO2014104053A1 | 2014-07-03 |
Foreign References:
| JP2014080555A | 2014-05-08 | |||
| JP2012216287A | 2012-11-08 | |||
| JP2013131385A | 2013-07-04 |
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