Title:
SUBSTRATE PROVIDED WITH CONDUCTIVE FILM, SUBSTRATE PROVIDED WITH MULTI-LAYER REFLECTION FILM, REFLECTIVE MASK BLANK, REFLECTIVE MASK, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2015/046095
Kind Code:
A1
Abstract:
Disclosed is a substrate that is provided with a conductive film, said substrate having the conductive film formed thereon. The substrate is characterized in that, in a relationship between a bearing area (%) and a bearing depth (nm), which are obtained by measuring, by means of an atomic force microscope, a region of 1 μm × 1 μm of a surface of the conductive film, the conductive film surface satisfies the relational expression of (BA70-BA30)/(BD70-BD30)=15-260 (%/nm), and has a maximum height (Rmax) of 1.3-15 nm.
Inventors:
HAMAMOTO KAZUHIRO (JP)
USUI YOICHI (JP)
USUI YOICHI (JP)
Application Number:
PCT/JP2014/074993
Publication Date:
April 02, 2015
Filing Date:
September 22, 2014
Export Citation:
Assignee:
HOYA CORP (JP)
International Classes:
H01L21/027; G03F1/24
Domestic Patent References:
| WO2010001843A1 | 2010-01-07 | |||
| WO2013146991A1 | 2013-10-03 |
Foreign References:
| JP2007272995A | 2007-10-18 | |||
| JP2004199846A | 2004-07-15 | |||
| JP2002288823A | 2002-10-04 | |||
| JPH0785463A | 1995-03-31 |
Attorney, Agent or Firm:
IKEDA, Noriyasu et al. (JP)
Noriyasu Ikeda (JP)
Noriyasu Ikeda (JP)
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