Title:
ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2017/033935
Kind Code:
A1
Abstract:
Provided is an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and minimize migration and keep the connection resistance low even when the electrode width and the electrode pitch are reduced. The electroconductive material according to the present invention: contains, on the outer surface portion of an electroconductive part, a heat-curable compound, an acid anhydride heat curing agent, and a plurality of electroconductive particles having solder; and exhibits a viscosity at 50°C of 10-200 Pa•s.
Inventors:
SADANAGA SHUUJIROU (JP)
NAGATA MAI (JP)
ITOU MASAHIRO (JP)
KUBOTA TAKASHI (JP)
ISHIZAWA HIDEAKI (JP)
NATSUI HIROSHI (JP)
NAGATA MAI (JP)
ITOU MASAHIRO (JP)
KUBOTA TAKASHI (JP)
ISHIZAWA HIDEAKI (JP)
NATSUI HIROSHI (JP)
Application Number:
PCT/JP2016/074532
Publication Date:
March 02, 2017
Filing Date:
August 23, 2016
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
H01B1/22; C09J9/02; C09J11/04; C09J201/00; H01B1/00; H01B5/16; H01R11/01
Domestic Patent References:
| WO2013125517A1 | 2013-08-29 |
Foreign References:
| JP2015098588A | 2015-05-28 | |||
| JP2012142271A | 2012-07-26 | |||
| JP2013149610A | 2013-08-01 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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