ELECTROCONDUCTIVE PASTE, ELECTRIC CIRCUIT, FLEXIBLE ELECTRIC CIRCUIT OBJECT, AND METHOD FOR PRODUCING MOLDED OBJECT

WIPO Patent Application WO/2024/009589

A1

Provided is an electroconductive paste capable of forming, in an electric circuit, an electric wiring line that is less likely to break even when the electric circuit and/or the electric wiring line is elongated and/or flexed.　This flexible electric circuit-forming electroconductive paste is for forming an electric circuit on the surface of a flexible substrate, and comprises (A) electroconductive particles, (B) a thermoplastic resin, and (C) a solvent. When the temperature Tm (°C) for measuring the storage modulus of the electroconductive paste is set to Tm=178°C, the storage modulus of a cured product obtained by curing the electroconductive paste at 120°C for 30 minutes is 0.001-0.5 GPa at said temperature Tm.

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YONEDA TAKASHI (JP)
OTOMO MASAYOSHI (JP)

PCT/JP2023/016035

January 11, 2024

April 24, 2023

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NAMICS CORP (JP)

H01B1/22; C08K3/01; C08L101/00; H01B1/00; H01B5/14; H05K1/02; H05K1/09

WO2020090757A1

2020-05-07

JP2015003935A	2015-01-08
JP2014216611A	2014-11-17
JP2011116968A	2011-06-16
JP2021121018A	2021-08-19

TSUKUNI & ASSOCIATES et al. (JP)

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