ELECTROCONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD, AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE PATTERN

Title:

ELECTROCONDUCTIVE PATTERN, ELECTRIC CIRCUIT, ELECTROMAGNETIC WAVE SHIELD, AND METHOD FOR MANUFACTURING ELECTROCONDUCTIVE PATTERN

Document Type and Number:

WIPO Patent Application WO/2013/146195

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing an electroconductive pattern which has such a high level of adhesion that an electroconductive layer comprising an electroconductive substance such as silver, etc. does not peel off from a primer layer over time. An electroconductive pattern according to the present invention, wherein an electroconductive layer (A) that comprises a compound (a1) having a basic nitrogen atom-containing group and an electroconductive substance (a2), a primer layer (B) that comprises a compound (b1) containing a functional group [X], and a supporting layer (C) are stacked, is characterized in that the basic nitrogen atom-containing group of the compound (a1) in the electroconductive layer (A) is reacted with the functional group [X] of the compound (b1) in the primer layer (B) to thereby form a bond.

Inventors:

MURAKAWA AKIRA (JP)
SHIRAKAMI JUN (JP)
FUJIKAWA WATARU (JP)
SAITOU YUKIE (JP)

Application Number:

PCT/JP2013/056486

Publication Date:

October 03, 2013

Filing Date:

March 08, 2013

Export Citation:

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Assignee:

DAINIPPON INK & CHEMICALS (JP)

International Classes:

H05K3/38; H05K1/09; H05K3/12; H05K9/00

Domestic Patent References:

WO2010134536A1

2010-11-25

Foreign References:

JP2007242781A	2007-09-20
JP2010251703A	2010-11-04
JPH10199332A	1998-07-31
JPH01259595A	1989-10-17
JP2009049124A	2009-03-05

Other References: