ELECTROCONDUCTIVE RESIN COMPOSITION AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT

WIPO Patent Application WO/2021/220976

A1

This manufacturing method for an electronic component is characterized by the following: having a preparation step for preparing an electronic component-use electrode formation body, and an electrode formation step for forming an electrode on an outer surface of the electronic component-use electrode formation body; and in the electrode formation step, an electroconductive resin composition is used to form an electroconductive resin layer on the electronic component-use electrode formation body, the electroconductive resin composition containing a metal powder, a resin binder, and an organic solvent, 20.0 mass% or greater of the metal powder being a flaky metal powder, and 70.0 mass% or greater of the resin binder being a silicone resin. According to the present invention, it is possible to provide a manufacturing method for an electronic component that, in addition to having a high durability to moisture, has a high manufacturing efficiency with few design- and manufacturing-based restrictions.

ESAKI SOICHIRO (JP)

PCT/JP2021/016514

November 04, 2021

April 23, 2021

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SHOEI CHEMICAL IND CO (JP)

C08L83/04; C08K3/08; C08L63/00; C08L83/06; H01B1/22; H01G4/232; H01G4/30; H01G9/042; H01G9/055; H01G13/00

WO2003035739A1	2003-05-01
WO2016104232A1	2016-06-30

JP2004168966A	2004-06-17
JPH11213756A	1999-08-06
JP2000133043A	2000-05-12
JP2014135463A	2014-07-24
JP2009295602A	2009-12-17
JPS6331522A	1988-02-10

ASHITABA INTERNATIONAL PATENT OFFICE (JP)

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