Title:
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2021/220975
Kind Code:
A1
Abstract:
A method for manufacturing an electronic component, characterized by having: a preparation step for preparing an electrode-forming body for an electronic component; and an electrode-forming step for forming an electrode on the outer surface of the electrode-forming body for an electronic component, an electrically conductive resin layer being formed on the electrode-forming body for an electronic component in the electrode-forming step, using an electrically conductive resin composition containing silicone resin. In the present invention, it is possible to provide the method for manufacturing an electronic component having high moisture resistance. Alternatively, it is possible to provide the method for manufacturing an electronic component that, in addition to having high moisture resistance, has few restrictions in terms of design and manufacturing, thus having high manufacturing efficiency.
Inventors:
ESAKI SOICHIRO (JP)
Application Number:
PCT/JP2021/016513
Publication Date:
November 04, 2021
Filing Date:
April 23, 2021
Export Citation:
Assignee:
SHOEI CHEMICAL IND CO (JP)
International Classes:
H01G13/00; H01G4/30; H01G9/055
Domestic Patent References:
| WO2016104232A1 | 2016-06-30 |
Foreign References:
| JP2014135463A | 2014-07-24 | |||
| JP2000215729A | 2000-08-04 | |||
| JP2018006501A | 2018-01-11 | |||
| JP2005248047A | 2005-09-15 | |||
| JP2009295602A | 2009-12-17 | |||
| JPS6331522A | 1988-02-10 |
Attorney, Agent or Firm:
ASHITABA INTERNATIONAL PATENT OFFICE (JP)
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