Title:
ELECTRODE CONNECTION STRUCTURE, MANUFACTURING METHOD THEREFOR, AND DIGITIZER COMPRISING SAME
Document Type and Number:
WIPO Patent Application WO/2023/177127
Kind Code:
A1
Abstract:
Embodiments of the present invention provide an electrode connection structure, a manufacturing method therefor, and a digitizer comprising same. The electrode connection structure includes: a base layer; a lower conductive line arranged on the upper surface of the base layer; an insulation interlayer which is formed on the upper surface of the base layer so as to partially cover the lower conductive line, and which includes a contact hole exposing the upper surface of the lower conductive line; and an upper conductive line arranged on the insulation interlayer so as to be electrically connected to the lower conductive line through the contact hole. The lower conductive line has a reduced thickness in the contact hole.
Inventors:
PARK MIN HYUK (KR)
CHOI BYUNG JIN (KR)
KIM JI YEON (KR)
CHOI BYUNG JIN (KR)
KIM JI YEON (KR)
Application Number:
PCT/KR2023/002927
Publication Date:
September 21, 2023
Filing Date:
March 03, 2023
Export Citation:
Assignee:
DONGWOO FINE CHEM CO LTD (KR)
International Classes:
G06F3/044; G06F3/046
Foreign References:
| KR102366863B1 | 2022-02-23 | |||
| KR20160123235A | 2016-10-25 | |||
| KR102027246B1 | 2019-10-01 | |||
| KR101900929B1 | 2018-09-21 | |||
| US9733676B2 | 2017-08-15 |
Attorney, Agent or Firm:
LEECHAE INTELLECTUAL PROPERTY (KR)
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