Title:
ELECTRODE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/215038
Kind Code:
A1
Abstract:
Disclosed in the present invention are an electrode manufacturing method, comprising: providing a substrate; forming a buffer layer on the substrate; forming a patterned photoresist on a surface of the buffer layer away from the substrate, wherein the photoresist has a bottom surface and a top surface disposed oppositely, and a side surface connecting the bottom surface and the top surface, and the bottom surface is attached to the buffer layer; removing, by means of dry etching, a portion of the buffer layer not covered by the photoresist to form an accommodation region; depositing an electrically conductive film layer comprising a waste material formed on the top surface and an electrode filled in the accommodation region; and stripping the waste material and the photoresist. The electrode manufacturing method of the present invention provides a high yield rate.
Inventors:
ZHOU ZHICHAO (CN)
XIA HUI (CN)
XIA HUI (CN)
Application Number:
PCT/CN2016/087677
Publication Date:
December 21, 2017
Filing Date:
June 29, 2016
Export Citation:
Assignee:
SHENZHEN CHINA STAR OPTOELECT (CN)
International Classes:
H01L21/82
Foreign References:
| CN103646924A | 2014-03-19 | |||
| CN1722376A | 2006-01-18 | |||
| US5902134A | 1999-05-11 |
Attorney, Agent or Firm:
GUANGZHOU SCIHEAD PATENT AGENT CO., LTD (CN)
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