Title:
ELECTROLESS NICKEL PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2017/199833
Kind Code:
A1
Abstract:
The present invention provides an electroless nickel plating method for forming a nickel film on a substrate (S) to be plated by immersing the substrate (S) to be plated, on which a composite (C) of metal particles (M) such as silver particles and a polymer (P) with anionic groups, polyalkylene imine, etc. has been attached, in an electroless nickel plating solution containing a water-soluble nickel salt, a reducing agent and a complexing agent. In the electroless nickel plating method, the reducing agent is hypophosphoric acid or a salt thereof, and when immersing the substrate (S) to be plated in the electroless plating solution, at least one kind of solid metal selected from a group consisting of nickel, iron and cobalt is included in the plating solution. Said plating method provides an adequate amount of adsorbed catalyst and is able to form a good electroless nickel plating film on a useful substrate to be plated such as resin, glass or ceramic without a complicated two-stage process.
Inventors:
FUKAZAWA NORIMASA (JP)
Application Number:
PCT/JP2017/017803
Publication Date:
November 23, 2017
Filing Date:
May 11, 2017
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C23C18/36; B22F1/16; B22F9/24; C23C18/02
Foreign References:
| JP2003183843A | 2003-07-03 | |||
| JP4697356B1 | 2011-06-08 | |||
| JP2010007124A | 2010-01-14 |
Attorney, Agent or Firm:
KONO Michihiro (JP)
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