Title:
ELECTROLESS PALLADIUM PLATING SOLUTION, AND ELECTROLESS PALLADIUM PLATED COATING
Document Type and Number:
WIPO Patent Application WO/2019/069964
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing an electroless palladium plating solution that yields a Pd plated coating constituting a plated coating having excellent wire bonding properties even with a heat history. This electroless palladium plating solution contains: a palladium compound; at least one selected from the group consisting of hypophosphite compounds and phosphite compounds; at least one selected from the group consisting of amine borane compounds and hydroboron compounds; and a complexing agent.
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Inventors:
MAEDA TSUYOSHI (JP)
TANABE KATSUHISA (JP)
WADA SHINSUKE (JP)
TANABE KATSUHISA (JP)
WADA SHINSUKE (JP)
Application Number:
PCT/JP2018/036970
Publication Date:
April 11, 2019
Filing Date:
October 03, 2018
Export Citation:
Assignee:
UEMURA KOGYO KK (JP)
International Classes:
C23C18/44
Foreign References:
| JP2011225927A | 2011-11-10 | |||
| JP2007009305A | 2007-01-18 | |||
| JP2007098563A | 2007-04-19 | |||
| JP2000256866A | 2000-09-19 | |||
| JP4596553B2 | 2010-12-08 | |||
| JP2017195651A | 2017-10-26 |
Other References:
See also references of EP 3693495A4
Attorney, Agent or Firm:
USFI PATENT ATTORNEYS INTERNATIONAL OFFICE (JP)
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