ELECTRONIC ASSEMBLY AND ELECTRONIC APPARATUS

WIPO Patent Application WO/2022/199386

A1

The present application provides an electronic assembly and an electronic apparatus. The electronic assembly comprises a first electronic device, a second electronic device, and an electrical connector. The first electronic device is electrically connected to the second electronic device by means of the electrical connector. The electrical connector comprises terminals and a first multilayer circuit board. The terminals comprise signal terminals and grounding terminals. The signal terminals are electrically connected to a signal interface of the first electronic device and a signal interface of the second electronic device. Signal terminals used for transmitting a same signal is a group of signal terminals, and at least one grounding terminal is provided between any two adjacent groups of signal terminals. The first multilayer circuit board comprises at least one layer of first grounding copper sheet. The first electronic device comprises a second multilayer circuit board, and the second multilayer circuit board comprises at least one layer of second grounding copper sheet. The grounding terminals are electrically connected to the first grounding copper sheet and the second grounding copper sheet to form a well-closed shielding cage. The electronic assembly has a strong interference shielding capability, such that a relatively high signal transmission rate can be supported.

CHEN ZONGXUN (CN)
LI JIANKANG (CN)
PEI HUAN (CN)
ZHU JIANG (CN)

PCT/CN2022/080042

September 29, 2022

March 10, 2022

Click for automatic bibliography generation  

HUAWEI TECH CO LTD (CN)

H01R33/76

WO2021052039A1

2021-03-25

US20090017682A1	2009-01-15
CN105896189A	2016-08-24

TDIP & PARTNERS (CN)

View/Download PDF      PDF Help

Previous Patent: WHEEL-LEGGED STRUCTURE AND ROBOT USING SAME

Next Patent: FILE PROCESSING METHOD AND SYSTEM, AND COMPUTER DEVICE AND MEDIUM