Title:
ELECTRONIC CIRCUIT DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/230442
Kind Code:
A1
Abstract:
An electronic circuit device according to the present invention is characterized in that: the electronic circuit device is provided with at least one semiconductor chip, serving as an electronic circuit element, and a rewiring layer comprising an insulating photosensitive resin layer, wherein the rewiring layer contains the semiconductor chip including a surface on which connection terminals are formed and side surfaces and has a plurality of wiring photo via holes that are electrically connected to the connection terminals of the semiconductor chip and that have different depths, as well as wiring lines for electrically connecting the wiring photo via holes on the same surface parallel to the surface, of the semiconductor chip, on which the connection terminals are formed; and each of the wiring photo via holes is shaped like a barrel in which a bottom section that is connected to the connection terminals of the semiconductor chip is continuous with side walls, wherein an opening surface at an upper section becomes narrower than an opening surface at an intermediate section between the bottom section and the upper section, which is on the opposite side from the bottom section.
Inventors:
AKEJIMA SHUZO (JP)
Application Number:
PCT/JP2020/011640
Publication Date:
November 19, 2020
Filing Date:
March 17, 2020
Export Citation:
Assignee:
RISING TECH CO LTD (JP)
International Classes:
H01L23/12; H01L25/04; H01L25/18
Domestic Patent References:
| WO2019049899A1 | 2019-03-14 |
Foreign References:
| JP2005183548A | 2005-07-07 | |||
| JP2007067216A | 2007-03-15 | |||
| US20180130745A1 | 2018-05-10 |
Attorney, Agent or Firm:
TAKAHASHI, HAYASHI AND PARTNER PATENT ATTORNEYS, INC. (JP)
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