Title:
ELECTRONIC COMPONENT ACCOMMODATING PACKAGE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE
Document Type and Number:
WIPO Patent Application WO/2020/218335
Kind Code:
A1
Abstract:
An electronic component accommodating package 100 is provided with: a base portion 105 which includes a first surface 102 having a recess 107 for mounting an electronic component 104, and a second surface 103 positioned opposite the first surface 102; an external connection conductor 115 positioned on the second surface 103; an internal wire 109 positioned inside the base portion 105; a first wire 109a positioned on the second surface 103 and connected to the internal wire 109; and a second wire 109b positioned between the first wire 109a and the external connection conductor 115, and connected to the external connection conductor 115. The first wire 109a and the second wire 109b are covered with an insulating layer 110.
Inventors:
ONITSUKA YOSHITOMO (JP)
IWATA TOMOYUKI (JP)
IWATA TOMOYUKI (JP)
Application Number:
PCT/JP2020/017332
Publication Date:
October 29, 2020
Filing Date:
April 22, 2020
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H01L23/02; H01L23/12
Foreign References:
| JP2019036740A | 2019-03-07 | |||
| JP2011199577A | 2011-10-06 | |||
| JP2007013020A | 2007-01-18 | |||
| JPH08288421A | 1996-11-01 |
Download PDF: