ELECTRONIC COMPONENT AND ELECTRONIC DEVICE

WIPO Patent Application WO/2022/111151

A1

Disclosed in the embodiments of the present application are an electronic component and an electronic device, which realize a three-dimensional stacked structure, achieve area reduction, and improve heat dissipation. According to the embodiments of the present application, the electronic component comprises an upper cover plate, a lower cover plate and an enclosure frame, wherein the upper cover plate carries a first circuit; the lower cover plate carries a second circuit; the enclosure frame is connected to the upper cover plate and the lower cover plate; an interconnection circuit is provided in the enclosure frame; the interconnection circuit is used to implement interconnection between the first circuit and the second circuit; and the first circuit and the second circuit are overlapped in the vertical direction under the condition that the first circuit and the second circuit do not interfere with each other. Since the height of the enclosure frame is not lower than a preset height that is greater than the sum of the height of the first circuit and the height of the second circuit, the three-dimensional stacked structure between the upper cover plate and the lower cover plate is achieved, thereby reducing the area of the electronic device.

SUN JIE (CN)
MO RUIMING (CN)
YANG XICHEN (CN)
XU YI (CN)

PCT/CN2021/125241

June 02, 2022

October 21, 2021

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HUAWEI TECH CO LTD (CN)

H01L25/16; H01L23/04; H01L23/10; H01L23/367

CN102056448A	2011-05-11
CN103249273A	2013-08-14
CN104284550A	2015-01-14
CN107301982A	2017-10-27
US20090168386A1	2009-07-02
CN202011374920A	2020-11-30

SHENPAT INTELLECTUAL PROPERTY AGENCY (CN)

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