Title:
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/014762
Kind Code:
A1
Abstract:
A housing 11 has a recess 11a in which a component is accommodated. A cover 12 covers the recess. A first laser-welded section 17a is disposed around the recess of the housing and fixes the cover to the housing. The cover 12 has an opening 12b within the laser-welded section 17a at a position corresponding to a portion of the periphery of the recess of the housing.
Inventors:
KOMURO TADASHI (JP)
KITSU SYOTO (JP)
KITSU SYOTO (JP)
Application Number:
PCT/JP2020/021469
Publication Date:
January 28, 2021
Filing Date:
May 29, 2020
Export Citation:
Assignee:
NIDEC COPAL ELECTRONICS CORP (JP)
International Classes:
H01H9/02; B23K26/21; B29C65/16; F16B5/08; H01H11/00; H01H19/04; H05K5/00
Domestic Patent References:
| WO2017047440A1 | 2017-03-23 |
Foreign References:
| JP2013058380A | 2013-03-28 | |||
| JP2006236825A | 2006-09-07 | |||
| JP2009234070A | 2009-10-15 | |||
| JP2006007420A | 2006-01-12 | |||
| JPH04129113A | 1992-04-30 |
Attorney, Agent or Firm:
S & S INTERNATIONAL PPC (JP)
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