Title:
ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2021/014761
Kind Code:
A1
Abstract:
An electronic component 10 is provided with a housing 11 and a cover 12. The housing 11 has a recess portion 11a in which a part is housed. The cover 12 covers the recess portion. A laser welded portion 17 including a discontinuous portion 19 is provided to the periphery of the recess portion of the housing so as to fix the cover to the housing.
Inventors:
KOMURO TADASHI (JP)
KITSU SYOTO (JP)
KITSU SYOTO (JP)
Application Number:
PCT/JP2020/021468
Publication Date:
January 28, 2021
Filing Date:
May 29, 2020
Export Citation:
Assignee:
NIDEC COPAL ELECTRONICS CORP (JP)
International Classes:
H01H9/02; B23K26/21; B29C65/16; F16B5/08; H01H11/00; H01H19/04; H05K5/00
Foreign References:
| JP2013058380A | 2013-03-28 | |||
| JPS612532A | 1986-01-08 | |||
| US20130050966A1 | 2013-02-28 | |||
| JP2010023272A | 2010-02-04 | |||
| JP2005007759A | 2005-01-13 | |||
| JPH04129113A | 1992-04-30 |
Attorney, Agent or Firm:
S & S INTERNATIONAL PPC (JP)
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