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Title:
ELECTRONIC COMPONENT MANUFACTURING METHOD AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2019/102701
Kind Code:
A1
Abstract:
Provided are an electronic component manufacturing method by which even a platable layer made of a difficult-to-plate material can be easily plated with good adhesion without using a special chemical solution or a photolithography technique, and an electronic component which has a peel strength of 0.1 N/mm or greater as measured by a copper foil peel test. A picosecond laser beam having a pulse duration on the order of a picosecond or a femtosecond laser beam having a pulse duration on the order of a femtosecond is emitted at a surface of a platable layer (2) in order to roughen the surface, a wiring pattern is formed using a mask (13), and a plated part (12) is formed on the surface of the wiring pattern.

Inventors:
OYA SATOSHI (JP)
KAIHARA SEIICHI (JP)
ATARASHI HIROSHI (JP)
SHIKATA HIROKAZU (JP)
Application Number:
PCT/JP2018/034567
Publication Date:
May 31, 2019
Filing Date:
September 19, 2018
Export Citation:
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Assignee:
QUALTEC CO LTD (JP)
International Classes:
C25D5/56; C23C18/20; C23C18/22; C25D5/02; H05K3/18; H05K3/38
Domestic Patent References:
WO2016152938A12016-09-29
Foreign References:
JP2017166003A2017-09-21
JP2015010268A2015-01-19
JP2008041938A2008-02-21
JP2005209817A2005-08-04
JPH07116870A1995-05-09
Other References:
MICRO-MACHINING TECHNIQUE USING FEMTOSECOND LASER, 2010, Retrieved from the Internet [retrieved on 20181112]
KAMIYAMA, HIROHARU: "Manufacturing Process of Printed Wiring Boards", JOURNAL OF THE SURFACE FINISHING SOCIETY OF JAPAN, vol. 44, no. 7, 1993, pages 566 - 572, XP055616699, DOI: 10.4139/sfj.44.566
Attorney, Agent or Firm:
KOHNO, Hideto et al. (JP)
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